FEATURES AND BENEFITS ● Thermal impedance: 0.22oC-in2 /W @ 50 psi ● Maximum heat transfer ● Aluminum foil coated both sides ● Designed to replace thermal grease TYPICAL APPLICATIONS ● Between a transistor and a heat sink ● Between two large surfaces such as an L-bracket and the chassis of an assembly ● Between a heat sink and a chassis ● Under electrically isolated power modules or devices such as resistors, transformers and solid state relays BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil coated on both sides with thermally/ electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. BERGQUIST SIL PAD TSP Q2500 is the ideal thermal interface material to replace messy thermal grease compounds . BERGQUIST SIL PAD TSP Q2500 eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. BERGQUIST SIL PAD TSP Q2500 also eliminates dust collection which can cause possible surface shorting or heat buildup.